Position Overview:
We are seeking a Principal Engineer to join our team in Grenoble. This role will focus on investigating and developing advanced technologies in electromagnetic, thermo-mechanical, and physicochemical simulation modeling for complex modules, particularly at their interfaces. The position will also involve utilizing in-situ non-destructive testing technologies.
Leading Engineering Projects
- Research and explore innovative technologies related to electromagnetic, thermo-mechanical, and physicochemical simulation modeling of complex modules, especially focusing on interfaces like BLT/TIM and underfill, employing in-situ non-destructive techniques.
- Provide technical insights into emerging technology trends and apply these insights to enhance client hardware products.
- Collaborate with local and Chinese teams to tackle upcoming challenges and assist in the preparation of specifications and design documents.
Essential Skills and Experience
- Extensive knowledge of microelectronics packaging, module substrate processes, and overall module processing, with the ability to independently conduct multi-physical field and multi-scale simulations and modeling for complex module packaging.
- Proficient in multi-scale and multi-physical field simulation modeling in electrical, magnetic, thermal, and mechanical domains, with a solid understanding of reliability packaging challenges such as warpage, stress management, thermo-migration, electro-migration, and heat dissipation.
- Strong understanding of material properties for essential layers like PCB, TIM, substrate, and underfill, along with their implications for overall integration.
- Significant experience with industrial simulation software such as COMSOL or HFSS familiarity with Python coding is a plus.
- Ability to work effectively both in teams and independently, along with strong communication skills for collaborating within a diverse group.
- Must be eligible to work in the European Union for this position.
- Fluency in English is required.
Benefits
- An opportunity to work on innovative projects and technologies in a dynamic environment.
- Collaboration with international teams to address significant challenges in microelectronics.
- Professional development and growth within an industry-leading company.
- Competitive salary and comprehensive benefits package.
If you are a visionary engineer with a passion for technological advancement and team leadership, we invite you to apply. Click 'Apply Now' to submit your CV and a cover letter showcasing your expertise and eagerness to lead pioneering engineering projects.
Commitment to Diversity and Inclusion
Our company is dedicated to promoting a diverse and inclusive workplace. We encourage applications from individuals of all genders, ethnicities, and backgrounds. Diversity not only enriches our team but also propels our innovation and success.